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Formation of W underlayer by switching bias sputtering to plug 0.25 μm contact holesJ. Onuki; M. Nihei; M. Suwa; H. Goshima · 1999
A Void Free Soldering Process in Large-Area, High Power Insulated Gate Bipolar Transistor ModulesJ. Onuki; Y. Chonan; T. Komiyama; M. Nihei; R. Saitou; M. Suwa; T. Morita · 2001