Discussion
- 期刊名称Proceedings of the IRE
- 作者Drew, S. V.; Rowe, R.; Panay, N.; Studd, J. W. W.
- 卷第23卷
- 期第6期
- 印刷ISSN0096-8390
- 文件大小377.30KB
- 发表时间1935-06
- DOI10.1109/jrproc.1935.226391
- 页码576-577
[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Multi Physics Modelling of the Electrodeposition ProcessHughes, M.; Bailey, C.; McManus, K. · 2007
[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - The needs of multi-scale/multi-physics simulation for RF Power packaging/product developmentYuan, Cadmus; Zhang, G.Q.; Salta, Joey; Jos, Rik · 2009