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The structure of electrodeposited copper—III: The effect of current density and temperature on growth habit

The structure of electrodeposited copper—III: The effect of current density and temperature on growth habit

S.C. Barnes; G.G. Storey; H.J. Pick

作者S.C. Barnes; G.G. Storey; H.J. Pick
卷第2卷
印刷ISSN0013-4686
文件大小694.10KB
发表时间1960
DOI10.1016/0013-4686(60)87018-1
页码195-204

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