Hybrid integrated circuits with beam lead silicon chips and beam lead subcarriers : M. Francois, Proc. Tech. Prog. INTER/NEPCON 1969, Brighton, 14–16 October (1969), p. 114

• 卷第9卷
• 期第6期
• 印刷ISSN0026-2714
• 文件大小114.36KB
• 发表时间1970
• DOI10.1016/0026-2714(70)90172-1