[WORLD SCIENTIFIC International Multiconference of Engineers and Computer Scientists (IMECS2014) & World Congress on Engineering 2014 (WCE 2014) - Hong Kong 12 – 14 March 2014 (London, UK 2 – 4 July 2014)] IAENG Transactions on Engineering Sciences - LTE DOWNLINK AND UPLINK PHYSICAL LAYER
TAKPOR, TEMITOPE O.; IDACHABA, FRANCIS E.
- 作者TAKPOR, TEMITOPE O.; IDACHABA, FRANCIS E.
- 文件大小259.81KB
- DOI10.1142/9789814667364_0029
- 页码387-400