System
- 期刊名称Physical Review Letters
- 作者Shapira, D.; DeVries, R. M.; Clover, M. R.; Boyd, R. N.; Cherry, R. N.
- 卷第40卷
- 期第6期
- 印刷ISSN0031-9007
- 文件大小709.67KB
- 发表时间1978-2-6
- DOI10.1103/PhysRevLett.40.371
- 页码371-374
[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Compact electro-thermal model of semiconductor device with nonlinear convection coefficientFeng, L.H.; Rudnyi, E.B.; Korvink, J.G.; Bohm, C.; Hauck, T. · 2005
[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Coupled electro-mechanics simulation methodology of the dynamic pull-in in micro-systemsRochus, V.; Rixen, D.J.; Golinval, J.-C. · 2005