Recent advances in solder bond technology for microelectronic packaging
- 作者P.M. Hall; J.M. Morabito
- 卷第72卷
- 期第3期
- 印刷ISSN0040-6090
- 文件大小757.97KB
- 发表时间1980
- DOI10.1016/0040-6090(80)90527-1
- 页码433-442
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