![[IEEE International Electron Devices Meeting. Technical Digest. IEDM - San Francisco, CA, USA (10-13 Dec. 2000)] International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138) - COM2 SiGe modular BiCMOS technology for digital, mixed-signal, and RF applications]()
[IEEE International Electron Devices Meeting. Technical Digest. IEDM - San Francisco, CA, USA (10-13 Dec. 2000)] International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138) - COM2 SiGe modular BiCMOS technology for digital, mixed-signal, and RF applicationsCarroll, M.; Ivanov, T.; Kuehne, S.; Chu, J.; King, C.; Frei, M.; Mastrapasqua, M.; Johnson, R.; Ng, K.; Moinian, S.; Martin, S.; Huang, C.; Hsu, T.; Nguyen, D.; Singh, R.; Fritzinger, L.; Esry, T.; Moller, W.; Kane, B.; Abeln, G.; Hwang, D.; Orphee, D.; Lytle, S.; Roby, M.; Vitkavage, D.; Chesire, D.; Ashton, R.; Shuttleworth, D.; Thoma, M.; Choi, S.; Lewllen, S.; Mason, P.; Lai, T.; Hsieh, H.; Dennis, D.; Harris, E.; Thomas, S.; Gregor, R.; Sana, P.; Wu, W. · 2000