Evaluation of Polyimide Thick Film High Temperature Polymeric Materials
- 期刊名称Microelectronics International
- 作者Hanassab, S.
- 卷第3卷
- 期第2期
- 印刷ISSN1356-5362
- 文件大小309.68KB
- 发表时间1986-02
- DOI10.1108/eb044228
- 页码38-41
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