The Effect of Moisture Content in Epoxy Film Adhesives on their Performance. III: Bulk Properties
Buchman, A.; Dodiuk, H.; Kenig, S.
- 期刊名称The Journal of Adhesion
- 作者Buchman, A.; Dodiuk, H.; Kenig, S.
- 卷第24卷
- 印刷ISSN0021-8464
- 电子ISSN1545-5823
- 文件大小556.55KB
- 发表时间1987-12
- DOI10.1080/00218468708075430
- 页码229-243