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[IEEE 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (13-14 June 1988)] 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - Submicron wiring technology with tungsten and planarization

[IEEE 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (13-14 June 1988)] 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - Submicron wiring technology with tungsten and planarization

Kaanta, C.; Cote, W.; Cronin, J.; Holland, K.; Lee, P.-I.; Wright, T.

作者Kaanta, C.; Cote, W.; Cronin, J.; Holland, K.; Lee, P.-I.; Wright, T.
文件大小374.80KB
发表时间1988
DOI10.1109/vmic.1988.14172
页码21-28

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