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[IEEE 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (13-14 June 1988)] 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - Reactive ion etching of thick CVD tungsten films
Jucha, B.; Davis, C.
- 作者Jucha, B.; Davis, C.
- 文件大小740.22KB
- 发表时间1988
- DOI10.1109/VMIC.1988.14189
- 页码165-171
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