[IEEE 26th Annual Proceedings Reliability Physics Symposium 1988 - Monterey, CA, USA (12-14 April 1988)] 26th Annual Proceedings Reliability Physics Symposium 1988 - Bond pad structure reliability

• 作者Ching, T.B.; Schroen, W.H.
• 文件大小431.78KB
• 发表时间1988
• DOI10.1109/relphy.1988.23428
• 页码64-70