Fatigue Fracture of Leads of SMT Components Caused by Ultrasonic Cleaning
- 期刊名称Microelectronics International
- 作者de Kluizenaar, E.E.
- 卷第5卷
- 期第2期
- 印刷ISSN1356-5362
- 文件大小318.16KB
- 发表时间1988-02
- DOI10.1108/eb044320
- 页码23-26
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