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Prediction of defect onset conditions in heat cycling based on a thermoelastic wafer model

Prediction of defect onset conditions in heat cycling based on a thermoelastic wafer model

Mokuya, K.; Matsuba, I.
  • 作者Mokuya, K.; Matsuba, I.
  • 卷第36卷
  • 期第2期
  • 印刷ISSN0018-9383
  • 电子ISSN1557-9646
  • 文件大小800.60KB
  • 发表时间1989
  • DOI10.1109/16.19932
  • 页码319-327
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