New profile of ultra low stress resin encapsulants for large chip semiconductor devices : Yoshinobu Nakamura, Shinjirou Uenishi, Teruo Kunishi, Kazuyuki Miki, Haruo Tabata, Kazuyuki Kuwada, Hideto Suzuki and Tsunetaka Matsumoto. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 502 (1987)
- 卷第29卷
- 期第4期
- 印刷ISSN0026-2714
- 文件大小274.18KB
- 发表时间1989
- DOI10.1016/0026-2714(89)90443-5
- 页码654-655