[IEEE Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (12-13 June 1989)] Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Copper as the future interconnection material
- 作者Pai, P.-L.; Ting, C.H.
- 文件大小936.23KB
- 发表时间1989
- DOI10.1109/vmic.1989.78029
- 页码258-264
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