[IEEE Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (12-13 June 1989)] Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Dielectric film deposition by atmospheric pressure and low temperature CVD using TEOS, ozone, and new organometallic doping sources
- 作者Nishimoto, Y.; Tokumasu, N.; Fujino, K.; Maeda, K.
- 文件大小599.68KB
- 发表时间1989
- DOI10.1109/vmic.1989.77998
- 页码382-389
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