[IEEE International Technical Digest on Electron Devices Meeting - Washington, DC, USA (3-6 Dec. 1989)] International Technical Digest on Electron Devices Meeting - Non-alloyed Al ohmic contact to GaAs for GaAs/Si interconnect compatibility
Goossen, K.W.; Cunningham, J.E.; Chiu, T.H.; Miller, D.A.B.; Chemla, D.S.
- 作者Goossen, K.W.; Cunningham, J.E.; Chiu, T.H.; Miller, D.A.B.; Chemla, D.S.
- 文件大小173.96KB
- 发表时间1989
- DOI10.1109/iedm.1989.74309
- 页码409-410