Residual stress in resin-molded IC chips.
- 期刊名称Transactions of the Japan Society of Mechanical Engineers Series A
- 作者MIURA, Hideo; NISHIMURA, Asao; KAWAI, Sueo; NISHI, Kunihiko
- 卷第55卷
- 期第516期
- 印刷ISSN0387-5008
- 电子ISSN1884-8338
- 文件大小917.68KB
- 发表时间1989
- DOI10.1299/kikaia.55.1763
- 页码1763-1770
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