![[ASME ASME 2011 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference - Washington, DC, USA (August 28–31, 2011)] Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference - Improving Adhesion Density and Coverage Uniformity of Antibody-Antigen Binding on a Sensor Surface Using U-Type, T-Type and W-Type Microfluidic Devices]()
[ASME ASME 2011 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference - Washington, DC, USA (August 28–31, 2011)] Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference - Improving Adhesion Density and Coverage Uniformity of Antibody-Antigen Binding on a Sensor Surface Using U-Type, T-Type and W-Type Microfluidic DevicesWu, Chia-Che; Tseng, Ping-Kuo; Tsai, Ching-Hsiu · 2011