[IEEE Micro Electro Mechanical Systems, An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots. - Napa Valley, CA, USA (11-14 Feb. 1990)] IEEE Proceedings on Micro Electro Mechanical Systems, An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots. - Spiral microstructures for the measurement of average strain gradients in thin films
- 作者Fan, L.-S.; Muller, R.S.; Yun, W.; Howe, R.T.; Huang, J.
- 文件大小358.60KB
- 发表时间1990
- DOI10.1109/MEMSYS.1990.110272
- 页码177-181
[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Content2007
[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Foreword2007
[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Copyright2007
[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Nanopackaging: Nanotechnologies and electronics packagingMorris, James E. · 2007
[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Proceedings of technical papers2007
[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - CMOS compatible directional microphonePo-Hsun Sung, ; Jen-Yi Chen, ; Kai-hsiang Yen, ; Chia-yu Wu, · 2007
[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Digital inkjet printing for etching circuitsGanjei, John; Sawoska, David; Krol, Andrew · 2007
[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - A novel packaging process for open-channel sensorsChung-Yi Hsu, ; Lung-Tai Chen, ; Jin-Sheng Chang, ; Chun-Hsun Chu, · 2007