Surface Impurities Encapsulated by Silicon Wafer Bonding
- 作者T. Abe; A. Uchiyama; K. Yoshizawa; Y. Nakazato; M. Miyawaki; T. Ohmi
- 文件大小934.93KB
- 发表时间1990
- DOI10.1143/JJAP.29.L2315
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