[IEEE International Electron Devices Meeting 1991 [Technical Digest] - Washington, DC, USA (8-11 Dec. 1991)] International Electron Devices Meeting 1991 [Technical Digest] - Sealed vacuum electronic devices by surface micromachining
Zurn, S.; Mei, Q.; Ye, C.; Tamagawa, T.; Polla, D.L.
- 作者Zurn, S.; Mei, Q.; Ye, C.; Tamagawa, T.; Polla, D.L.
- 文件大小382.34KB
- 发表时间1991
- DOI10.1109/iedm.1991.235466
- 页码205-208