Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages.
- 期刊名称Transactions of the Japan Society of Mechanical Engineers Series A
- 作者MIURA, Hideo; NISHIMURA, Asao; KAWAI, Sueo; NISHI, Kunihiko
- 卷第57卷
- 期第539期
- 印刷ISSN0387-5008
- 电子ISSN1884-8338
- 文件大小633.90KB
- 发表时间1991
- DOI10.1299/kikaia.57.1575
- 页码1575-1580
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Recovery Stress and Recovery Strain of TiNi Shape Memory Alloy : Cyclic Properties under Constant Residual Strain and Constant Maximum StressTOBUSHI, Hisaaki; OHASHI, Yoshio; SAIDA, Haruo; HORI, Tatsuya; SHIRAI, Shuji · JSME international journal. Ser. 1, Solid mechanics, strength of materials · 1992
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