Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages under Temperature Cycling.
- 期刊名称Transactions of the Japan Society of Mechanical Engineers Series A
- 作者MIURA, Hideo; KITANO, Makoto; NISHIMURA, Asao; KAWAI, Sueo; NISHI, Kunihiko
- 卷第57卷
- 期第542期
- 印刷ISSN0387-5008
- 电子ISSN1884-8338
- 文件大小659.27KB
- 发表时间1991
- DOI10.1299/kikaia.57.2415
- 页码2415-2421
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