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Solute pairing in solution-hardened Cu-Ni, Cu-Pd binary, and Cu-Ni-Pd ternary fcc alloys

Solute pairing in solution-hardened Cu-Ni, Cu-Pd binary, and Cu-Ni-Pd ternary fcc alloys

Wong, Joe; Nixon, W. E.; Mitchell, J. W.; Laderman, S. S.

期刊名称Journal of Applied Physics
作者Wong, Joe; Nixon, W. E.; Mitchell, J. W.; Laderman, S. S.
卷第71卷
期第1期
印刷ISSN0021-8979
文件大小1026.04KB
发表时间1992
DOI10.1063/1.350728

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