SPIE Proceedings [SPIE Dry Etch Technology - San J, United States (Monday 9 September 1991)] Dry Etch Technology - Relationship between DUV lithography and etch for pattern transfer
Witowski, Joyce Z.; Capsuto, Elliott S.; Sethi, Satyendra S.; Kochan, John; Ranadive, Deepak
- 作者Witowski, Joyce Z.; Capsuto, Elliott S.; Sethi, Satyendra S.; Kochan, John; Ranadive, Deepak
- 卷第1593卷
- 印刷ISSN0277-786X
- 文件大小2514.19KB
- 发表时间1992
- DOI10.1117/12.56928
- 页码105-117