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SPIE Proceedings [SPIE Dry Etch Technology - San J, United States (Monday 9 September 1991)] Dry Etch Technology - <title>How to etch the optimal silicon trench: profile development and process discussion</title>

SPIE Proceedings [SPIE Dry Etch Technology - San J, United States (Monday 9 September 1991)] Dry Etch Technology - How to etch the optimal silicon trench: profile development and process discussion

Pilz, Wolfgang; Graendorff, K.; Janes, Joachim; Pelka, Joachim; Ranadive, Deepak
  • 作者Pilz, Wolfgang; Graendorff, K.; Janes, Joachim; Pelka, Joachim; Ranadive, Deepak
  • 卷第1593卷
  • 印刷ISSN0277-786X
  • 文件大小595.08KB
  • 发表时间1992
  • DOI10.1117/12.56931
  • 页码178-185
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