A dislocation model of shear fatigue damage and life prediction of SMT solder joints under thermal cycling : Jihuo Huang et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15 (4), 553 (1992)

• 卷第33卷
• 期第13期
• 印刷ISSN0026-2714
• 文件大小113.11KB
• 发表时间1993
• DOI10.1016/0026-2714(93)90369-a