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Selective reactive ion etching in SiCl4/SiF4 plasmas for gate recess in GaAs/AlGaAs modulation-doped field effect transistors

Selective reactive ion etching in SiCl4/SiF4 plasmas for gate recess in GaAs/AlGaAs modulation-doped field effect transistors

D. G. Ballegeer
  • 作者D. G. Ballegeer
  • 文件大小1233.29KB
  • 发表时间1993
  • DOI10.1116/1.586810
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