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[IEEE 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) - Washington, DC, USA (4-7 May 1994)] Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) - Modelling of thermal vias in thin film multichip modules

[IEEE 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) - Washington, DC, USA (4-7 May 1994)] Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) - Modelling of thermal vias in thin film multichip modules

Christiaens, F.; Beyne, E.; Berghmans, J.

作者Christiaens, F.; Beyne, E.; Berghmans, J.
文件大小532.64KB
发表时间1994
DOI10.1109/ITHERM.1994.342909
页码101-107

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