[IEEE 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) - Washington, DC, USA (4-7 May 1994)] Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) - Cooling performance of plate fins for multichip modules
- 作者Iwasaki, H.; Sasaki, T.; Ishizuka, M.
- 文件大小356.49KB
- 发表时间1994
- DOI10.1109/itherm.1994.342904
- 页码144-147
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