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[IEEE International Workshop on Numerical Modeling of processes and Devices for Integrated Circuits: NUPAD V - Honolulu, HI, USA (5-6 June 1994)] Proceedings of International Workshop on Numerical Modeling of processes and Devices for Integrated Circuits: NUPAD V - Modeling of Ti physical vapor deposition systems

[IEEE International Workshop on Numerical Modeling of processes and Devices for Integrated Circuits: NUPAD V - Honolulu, HI, USA (5-6 June 1994)] Proceedings of International Workshop on Numerical Modeling of processes and Devices for Integrated Circuits: NUPAD V - Modeling of Ti physical vapor deposition systems

Bang, D.S.; McVittie, J.P.; Islamraja, M.M.; Saraswat, K.C.; Krivokapic, Z.; Cheung, R.
  • 作者Bang, D.S.; McVittie, J.P.; Islamraja, M.M.; Saraswat, K.C.; Krivokapic, Z.; Cheung, R.
  • 文件大小268.99KB
  • 发表时间1994
  • DOI10.1109/nupad.1994.343495
  • 页码41-44
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