[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - Probabilistic sensitivity analysis for the dynamic response of electronic systems: a study of the interactions of molding compound and die attach adhesive, with regards to package cracking
- 作者Jensen, H.A.; Cifuentes, A.O.
- 文件大小573.00KB
- 发表时间1994
- DOI10.1109/ectc.1994.367643
- 页码107-114