Enhanced Cooling of Shape Memory Alloy Wires Using Semiconductor "Heat Pump" Modules
- 期刊名称Journal of Intelligent Material Systems and Structures
- 作者Shahin, A. R.; Meckl, P. H.; Jones, J. D.; Thrasher, M. A.
- 卷第5卷
- 期第1期
- 印刷ISSN1045-389X
- 文件大小789.95KB
- 发表时间1994-01-01
- DOI10.1177/1045389X9400500111
- 页码95-104
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