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[IEEE 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) - Washington, DC, USA (4-7 May 1994)] Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) - Predicting thermal contact resistance in circuit card assemblies

[IEEE 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) - Washington, DC, USA (4-7 May 1994)] Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) - Predicting thermal contact resistance in circuit card assemblies

Kunkel, S.H.; Peck, W.M.

作者Kunkel, S.H.; Peck, W.M.
文件大小597.24KB
发表时间1994
DOI10.1109/ITHERM.1994.342910
页码91-100

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