Interconnection Technology for Modern Logic Devices; an Exercise in System Engineering to Assure Manufacturability
- 期刊名称MRS Proceedings
- 作者Siegle, William T.
- 卷第337卷
- 电子ISSN1946-4274
- 文件大小2922.11KB
- 发表时间1994-1
- DOI10.1557/proc-337-3
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