Effects of Interlayers on the Scratch Adhesion Performance of Ultra-Thin Films of Copper and Gold on Silicon Substrates
- 期刊名称MRS Proceedings
- 作者McAdams, S. D.; Tsui, T. Y.; Oliver, W. C.; Pharr, G. M.
- 卷第356卷
- 电子ISSN1946-4274
- 文件大小2011.32KB
- 发表时间1994-1
- DOI10.1557/proc-356-809
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