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[IEEE 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (27 Nov.-1 Dec. 1995)] Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Oxidation of copper leadframe

[IEEE 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (27 Nov.-1 Dec. 1995)] Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Oxidation of copper leadframe

Ang, G.L.; Goh, L.C.; Heng, K.W.; Lahiri, S.K.

作者Ang, G.L.; Goh, L.C.; Heng, K.W.; Lahiri, S.K.
文件大小246.83KB
发表时间1995
DOI10.1109/ipfa.1995.487626
页码218-220

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