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[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (2-4 Oct. 1995)] Proceedings of Electrical Performance of Electronic Packaging - Experimental circuit modeling of coupled interconnection structures based on causality

[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (2-4 Oct. 1995)] Proceedings of Electrical Performance of Electronic Packaging - Experimental circuit modeling of coupled interconnection structures based on causality

Sercu, S.; Martens, L.
  • 作者Sercu, S.; Martens, L.
  • 文件大小157.11KB
  • 发表时间1995
  • DOI10.1109/epep.1995.524869
  • 页码120-122
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