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[IEEE Annual Reliability and Maintainability Symposium 1995 - Washington, DC, USA (16-19 Jan. 1995)] Annual Reliability and Maintainability Symposium 1995 Proceedings - Test-time compression for qualification testing of electronic packages: a case study

[IEEE Annual Reliability and Maintainability Symposium 1995 - Washington, DC, USA (16-19 Jan. 1995)] Annual Reliability and Maintainability Symposium 1995 Proceedings - Test-time compression for qualification testing of electronic packages: a case study

Rothman, T.P.; Dasgupta, A.; Hu, J.M.

作者Rothman, T.P.; Dasgupta, A.; Hu, J.M.
文件大小658.94KB
发表时间1995
DOI10.1109/rams.1995.513253
页码246-252

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