Silicon Wafer Direct Bonding through the Amorphous Layer
- 期刊名称Japanese Journal of Applied Physics
- 作者Fujino, Seiji; Matsui, Masaki; Hattori, Tadashi; Hamakawa, Yoshihiro
- 卷第34卷
- 印刷ISSN0021-4922
- 文件大小152.07KB
- 发表时间1995-10-15
- DOI10.1143/JJAP.34.L1322
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