Influence of short circuits on data of contact and via open circuits determined by a novel weave test structure

• 期刊名称IEEE Transactions on Semiconductor Manufacturing
• 作者Hess, C.; Weiland, L.H.
• 卷第9卷
• 期第1期
• 印刷ISSN0894-6507
• 文件大小1608.40KB
• 发表时间1996
• DOI10.1109/66.484280
• 页码27-34