发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V - Orlando, FL, USA (29 May-1 June 1996)] InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V - A virtual prototyping environment for multi-scale, multi-disciplinary simulation of electronics packaging of MCMs

[IEEE InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V - Orlando, FL, USA (29 May-1 June 1996)] InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V - A virtual prototyping environment for multi-scale, multi-disciplinary simulation of electronics packaging of MCMs

Przekwas, A.J.; Jiang, Y.; Athavale, M.M.; Wang, Z.J.; van der Zijp, J.
  • 作者Przekwas, A.J.; Jiang, Y.; Athavale, M.M.; Wang, Z.J.; van der Zijp, J.
  • 文件大小910.26KB
  • 发表时间1996
  • DOI10.1109/itherm.1996.534583
  • 页码352-358
同期刊推荐
← 返回【学霸图书馆】主页
© 2026 学霸图书馆 · 让阅读成为习惯