A STUDY OF SOLDERABILITY AND SOLDER SPREADING FOR SMT OPEN JOINTS
- 期刊名称Journal of Electronics Manufacturing
- 作者CHOON, TEO KIAT
- 卷第6卷
- 期第4期
- 印刷ISSN0960-3131
- 文件大小1292.43KB
- 发表时间1996-12
- DOI10.1142/S0960313196000226
- 页码243-260
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