Atomic Mechanics Simulation on Nucleation Process of Grain Boundary Groove in Aluminum Conductor of Microelectronic Packages
- 期刊名称JSME international journal. Ser. A, Mechanics and material engineering
- 作者KITAMURA, Takayuki; OHTANI, Ryuichi; YAMANAKA, Tetsuya; YASHIRO, Kisaragi
- 卷第39卷
- 期第3期
- 印刷ISSN0914-8809
- 文件大小750.05KB
- 发表时间1996
- DOI10.1299/jsmea1993.39.3_291
- 页码291-296
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