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[IEEE 1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual - Denver, CO, USA (8-10 April 1997)] 1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual - Short-timescale thermal mapping of interconnects

[IEEE 1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual - Denver, CO, USA (8-10 April 1997)] 1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual - Short-timescale thermal mapping of interconnects

Yongho Sungtaek Ju, ; Goodson, K.E.
  • 作者Yongho Sungtaek Ju, ; Goodson, K.E.
  • 文件大小642.93KB
  • 发表时间1997
  • DOI10.1109/RELPHY.1997.584281
  • 页码320-324
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