Electronic Components Obsolescence
Condra, L.W.; Anissipour, A.A.; Mayfield, D.D.; Pecht, M.G.
- 期刊名称IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- 作者Condra, L.W.; Anissipour, A.A.; Mayfield, D.D.; Pecht, M.G.
- 卷第20卷
- 期第3期
- 印刷ISSN1070-9886
- 文件大小78.01KB
- 发表时间1997-09
- DOI10.1109/tcpma.1997.623032
- 页码368-371