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[IEEE 1997 21st International Conference on Microelectronics. Proceedings - Nis, Yugoslavia (14-17 Sept. 1997)] 1997 21st International Conference on Microelectronics. Proceedings - 2D modelling of mechanical stress evolution and electromigration in confined aluminum interconnects

[IEEE 1997 21st International Conference on Microelectronics. Proceedings - Nis, Yugoslavia (14-17 Sept. 1997)] 1997 21st International Conference on Microelectronics. Proceedings - 2D modelling of mechanical stress evolution and electromigration in confined aluminum interconnects

Petrescu, V.; Mouthaan, A.J.

作者Petrescu, V.; Mouthaan, A.J.
卷第2卷
文件大小392.09KB
发表时间1997
DOI10.1109/icmel.1997.632920
页码629-632

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